Smiths Connectors is now Smiths Interconnect


MarketID in (29,30,55,60,61)
  • Connecteur léger et à haute densité
  • Jusqu'à 2 000 cycles d'insertion-extraction
  • Faible force d'insertion
  • Protection IP67 une fois accouplé
  • Nombre de composants reduit

High density HDLP range of rectangular PCB connectors are designed for use in space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance. With IP67 sealing when mated, the HDLP series is particularly suitable for missile guidance and propulsion systems, ruggedized computer systems, camera or display applications, and communications panels and enclosures. 

Available in variants that include PCB-to-PCB, PCB-to-flying-lead and PCB-to-flex, the HDLP series is designed to reduce the PCB real estate necessary for making data connections. PCB-to-PCB options include stacking and card-edge versions, for even greater flexibility. The connectors include an interfacial seal and encapsulated contacts to achieve a high level of sealing, with optional conformal coating available to provide further environmental integrity. 


Pitch Through hole: 1.5mm (horizontally) 1.3mm (vertically)
PCB pad spacing: 0.75mm
Contact Diameter 0.39 mm/0.015 inches
Contact Life Cycles 2,000+ operations
Temperature Range -55°C to125°C
Current Rating 2 A per contact
Voltage Rating 110 VDC or AC peak nominal
Contact Resistance 8 milliohms max.
Extraction Forces 28.3 gr./ 1.0 oz.


Insulator Material Liquid Crystal Polymer (LCP)
Contact Material Copper Alloy
Contact Plating ASTM-488-B (Type III, grade C, Class 1)
Socket Wire Material Beryllium Copper
Interfacial Seal Material Fluorosilicone
Guides Material Stainless steel