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  • Offset grid contact layout, one or two contact rows within dielectric connector body
  • 5.08mm center-to-center contact spacing in each row and 5.08mm row-to-row spacing if applicable
  • 1.5mm nominal pin DIA contact size; 3,5 and 9 contact positions
  • Hand solder, dip solder and crimp termination styles.

Smiths Connectors CEA data transfer connectors for industrial applications. 1.5mm nominal pin DIA contact size; 3, 5 and 9 contact positions; Right angle through board solder, Straight through board solder, Solder cup and Crimp termination styles.

Configuration

Contact Positions 3 to 9
Contact Termination Right angle through board, solder, Straight through board solder, Solder cup
Contact Dia. 1.5 mm nominal pin DIA
Nominal Current 8 A
Contact Life Cycle 1,000,000
Contact Resistance ≤2.5 mΩ
DWV 2000 VRMS –sea level
Temperature Range -65 °C to +125 °C
Insulation Resistance >106 MΩ at 500 V d.c
Insulator PE, V0 per UL94
All specifications are subject to change without notice