Smiths Connectors is now Smiths Interconnect

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MarketID in (3,4,11)
  • Offset-grid contact layout
  • Four contact rows within dielectric connector body
  • 1.905 mm center-to-center contact spacing in each row and 1.905 row-to-row spacing.
  • 0.6 mm nominal pin DIA contact size; 42 to 316 contact positions
  • Dip solder and SMT soldering contact termination types.
  • High contact density, low connector weight, lowmating force. High shock and vibration proof (no micro interruptions - test: 2ns).
  • Conform to ESA specification.

High density signal, PCB connectors, 4 contact rows with flex for space applications conform to ESA specification. 

Configuration

Number of Rows/Ways     4
Pitch 1.905 offset grid
Contact Positions 42 to 316
Contact Termination Right angle through board solder, Straight through board solder, Flex circuit
Nominal Current 3 A
Nominal Pin Dia. 0,6 mm
Qualifications MIL-DTL-55302, TPR 02013, ESA ESCC 3401
All specifications are subject to change without notice