MarketID in (1,3,4,5,6,7,8,11,12)
  • 0.100" (2.54) pitch
  • Design flexibility
  • Ground and power currents available
  • 6 mm and 4 mm compressed heights
  • Surface mount, thru hole and solder cup terminations offered 

C Series probes, renowned for their reliable performance in shock and vibration environments, housed in standard and customized connector footprints.  

Benefits:

  • Exceptional compliance
  • Great for RF, high speed and mixed signal connectors
  • Ground contacts mate first, break last to support hot swap applications
  • Power contacts are designed to support increased current carrying capacity
  • Ensure a rugged, reliable connection in the harshest environments
  • Allow unique blind mate capabilities
  • Advanced misalignment tolerance
  • Direction connections for rotating or sliding joints

Technical Characteristics

Electrical

  Current Rating Ground: 10 A continuous
Power: 10 A continuous
Bias Ball*: 15 A continuous
(individual probe in free air @ ambient temperature)
  Typical Resistance Ground: < 10 mΩ
Power: < 10 mΩ
Bias Ball*: < 10 mΩ

Mechanical

  Minimum Centers 0.100 (2.54)
  Spring Force 4 mm: 85 g @ working travel
6 mm: 82 g @ working travel
Bias Ball*: 130 g @ working travel
  Working Travel 4 mm Ground: 0.039 (1.00)
4 mm Power: 0.028 (0.71)
6 mm Ground: 0.098 (2.50)
6 mm Power: 0.079 (2.00)
  Maximum Travel 4 mm Ground: 0.039 (1.00)
4 mm Power: 0.028 (0.71)
6 mm Ground: 0.098 (2.50)
6 mm Power: 0.079 (2.00)

Materials

  Barrel Brass, gold plated
  Spring Stainless steel
  Plunger Brass, gold plated

Recommendations

 
  Mounting Hole 0.064/0.065 (1.62/1.65)
  Surface Mount Pad Size 0.085 (2.20)
  Solder Cup Wire Gage 20 gage max.
  Thru Hole Drill Size 0.035 (0.89)