Smiths Connectors is now Smiths Interconnect

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  • Fully footprint compatible with VITA 46 and VITA 48 standards
  • Utilizes industry guide hardware
  • Verified for 6.25Gbps data rate performance
  • 100 ohm impedance for differential pair configurations
  • Flexible modular design for standard 3U and 6U as well as custom configurations

Smiths Connectors KVPX connector is a shielded, high-density, high-speed, modular interconnect system optimized for differential pair architectures on a 1.8mm x 1.35mm grid. The waferized daughter-card assembly also provides single-ended and power wafer options. The backplane modules are available in 8 and 16 row increments on a 1.8mm x 1.8mm grid, with user-configurable keying and integrated stainless steel guide pin/keys. The KVPX connector platform offers the ability to scale from 80 Mbps to over 10 Gbps while retaining the same Vita 46 backplane slot pitch at 20.3mm to 25.4mm. 

Through the use of the proven 0.40mm Hypertac® hyperboloid contact, KVPX connectors provide immunity to shock and vibration fretting, numerous linear paths of contact, and a self-cleaning wipe action that results in consistently better signal integrity for high reliability applications across a wide range of industries. The Hypertac contact system offers low insertion and extraction forces, low contact resistance, as well as industry leading mating cycles. Manufactured with 30 percent glass filled liquid crystal polymer (LCP) insulators and potted contacts, KVPX connectors withstand the high temperatures associated with soldering. The LCP insulators also exceed NASA space requirements for outgassing and have inherent keying features to prevent improper mating. 

KVPX Series connectors perform under the most severe conditions, giving them the edge in demanding critical applications for military, aerospace, industrial, and medical devices. 

Additional Features:

  • Differential, single-ended and power
  • Separable interface offering 70 single-ended signals/25.4mm and 63 differential signals/25.4mm
  • Reliable, Hypertac® Hyperboloid contact technology
  • ESD protection supports 2 level maintenance designs
  • 0.56 mm (.022 in) diameter via for backplane connector
  • Current Rating:  12.5 A per power wafer and 1.5625 A per contact

Specifications

Number of Contacts Half module - 72; Full module - 144
Pitch 1.8mm
Current Rating 1.5625 A per contact 12.5 A per power wafer 
  (derated using a 30°C temperature rise and 1 oz copper)
Extraction Force 1.2 oz per contact typical
Temperature Rating -55°C to 125°C
Insulator Material LCP (Liquid Crystal Polymer)
Contact Plating 50 μin gold over nickel
Flammability Rating UL94-VO
Dielectric Withstanding Voltage 500 VAC
Low Level Circuit Resistance 8 milliohms maximum
Insulation Resistance 500 megohms maximum
Random Vibration 11.95 Grms 50 to 2000 Hz for 90 mins per axis
Mechanical Shock 50G 11 msec 3 shocks/direction (18 total)
All specifications are subject to change without notice