Smiths Connectors is now Smiths Interconnect

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  • Electrically transparent contact
  • Solderless memory replacement
  • Low, stable contact resistance
  • High frequency bandwidth > 40 GHz
  • Signal path length <1mm

Silmat® is a patented, low profile contact engineered specifically to provide electrical and mechanical advantages in the Digital High Speed and PoP Top segments of the Semiconductor Test industry.

 
  • Patented, low profile contact
    • Solderless memory replacement
    • Short signal path
    • Conformal to recessed LGAs
  • High speed signal integrity
    • Electrically transparent contact
    • High frequency bandwidth > 40 GHz
    • Low inductance
  • Durability
    • Long cycle life > 500,000 cycles (application dependent)
    • No PCB or solder ball damage
    • Minimal labor and tester downtime
  • Engineering expertise
    • Monte Carlo Analysis
    • Thermal Analysis
    • RF Simulation