Smiths Connectors is now Smiths Interconnect

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  • Suited for pitches 300 to 500 µm
  • High degree of parallelism
  • High density
  • Stable c-res over 750K cycles
  • Excellent co-planarity

The unique precision afforded by Smiths Connectors’ floating spring probe designs allows for seamless deployment in testing Wafer Level Chip Scale Packages. Smiths Connectors works closely with customers to develop contactors which are used as probe heads in place of cantilever and traditional vertical probe card technologies.

Smiths Connectors has created thousands of probe heads for every type of device and prober. In that process, we have created a WLCSP-optimized family of spring contact probes, the Volta Series.

Volta Series probe cards have exceptional DC and RF performance, enabling functional test at wafer level. They are cost-effective and easy to maintain. Our applications team engages customers to select the optimal contactor material for each application based on geometric requirements and device pin count. Innovative manual test kits are available which make setup and first silicon test effortless.